Heller 1700EXL Reflow Oven

The 1700EXL provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The oven features enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven-to-oven. The 1700EXL offers unmatched flexibility in board handling with a module response of less than one second to temperature changes of less than 0.1 degrees C, plus being able to maintain profile integrity for heavy board loads. Other features include advanced five-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs. User-friendly WindowsTM software makes alternate curing configuration, with topside IR panels to create a temperature differential that protects heat-sensitive components.

specs (pdf)

Heller 1700EXL Reflow Oven Features:

• Computer-controlled automatic lubrication system for "hands-off" maintenance
• Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" maintenance with no downtime and no change in oven PPM levels
• Six-sigma reliability for the most demanding production environments
• Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment
• Rapid profiling changes plus fast warm-up and cool-down
• Wide process window for "universal profiling"- allows many different boards to be run on single temperature profile