Quad APS-1, APS-1H Advanced Placement Systems

APS-1 Pick and Place System

The APS-1 sustains fast, accurate placement alone or in-line. Its rigid frame gives you mechanical stability. Center-drive linear servomotors provide smooth, precise operation. The patented QuadAlign System optically aligns components and die on-the-fly, limiting vision camera trips and saving time. High-resolution upward vision expands the component range.

APS-1H Pick and Place System

The APS-1H addresses the needs of hybrid market while providing full SMT assembly capabilities In addition to having all the features of the standard APS-1, the APS-1H handles wafer, waffle, and tape presentation.

Its large tabletop accepts up to 108 two-inch waffle packs or custom tooling to minimize setup and changeover time and maximize productivity. With High magnification With the Pick Preview feature, the APS-1H can pick die "on-center" from oversized waffle pack cells. The APS-1H also has programmable placement force to protect fragile die by enabling you to set the amount of placement force and duration for each die type.

• specs
• Quad align

Quad APS-1 Pick and Place System Features:

• Direct Drive Theta: This feature provides the accuracy required in placing high lead QFP and BGA components.
• Non-Contact Linear Encoders: The APS-1 incorporates true linear positional feedback of the placement head for guaranteed long-term accuracy in the X- and Y-axes.
• QSoft-2: A unique system architecture that takes full advantage of Windows 98 and Intel Pentium processing to provide you with quick setup, easy programming, and fastplacement sequence optimization.
• QuadAlign: This innovative optical centering technique precisely measures and aligns leaded and nonleaded surface mount components "on-the-fly.
• P4 Head Technology: This patented technology integrates two pickup nozzles with two independent Quad Align systems to process two components simultaneously and increases placement through put and provides in-process lead alignment of QFPs and BGAs
• Programmable Transport: The APS-1 uses software-controlled motion to reduce board transport time. The unique multistage positioning system also minimizes the effect of board warpage, and improves board accuracy.
• Process Monitoring with Adaptive Control: The APS-1 with QuadAlign monitors components to correct pickup offsets automatically. They also monitor vacuum levels and other critical machine parameters, providing full reporting capabilities for automatic process stability.

In addition to the features above the APS-1H provides the following outstanding capabilities as standard features:

• Pick Preview: Enables the APS-1H to pick die "on-center" from oversized waffle pack cells. The centered pickup tool applies balanced force across the component, resulting in a uniform bondline thickness.
• Programmable Placement Force: This feature protects fragile die and allows you to adjust placement force and duration for each die type.
• Large Tabletop Area: The APS-1H's large tabletop accepts up to 108 two-inch waffle packs or custom tooling to minimize setup and changeover time and maximize productivity.