Heller 1500EXL Reflow Oven

The 1500EXL - from Heller's newest generation of reflow ovens- provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The 1500EXL features Heller's new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven to oven. It also provides more flexibility in board handling, more robust construction and a more streamlined appearance. The 1500EXL supports line speeds up to 28 inches (70 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

specs (pdf)

Heller 1500EXL Reflow Oven Features:

• The most efficient heat transfer, from extra high-volume, high-velocity, heating modules, producing temperature gradients of less than 2oC throughout the oven
• Instant-response heating modules that react in less than one second to temperature changes of less than 0.1oC to maintain profile integrity for heavy board loads
• Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment
• The lowest nitrogen consumption in the industry: 350 SCFH* with our Ultra Low option
• Six-sigma reliability for the most demanding production environments
• Single or dual-rail edge hold conveyor for greater versatility in board handling.
• User-friendly WindowsTM software.Alternate curing configuration, with topside IR panels to create a temperature differential that protects heatsensitive components
• An optional UV module may be added for UV cure adhesives